Last month, Samsung launched its latest flagship Galaxy S24 series with One UI 6.1 and Galaxy AI features and improvements. Now, Galaxy users are enjoying the new features of the Galaxy S24, meanwhile, rumors about the Galaxy S25 lineup have already started hitting the web. A recent leak suggests that the company is planning to use FOWLP for the Exynos processors used in the Samsung Galaxy S25 series.
According to the information, Samsung will implement FOWLP on ‘Exynos 2500 (tentative name)’ which will be included in the Galaxy S25 series to be released in the first half of next year. Galaxy S25 series including Galaxy S25, Galaxy S25 Plus, and Galaxy S25 Ultra.
Furthermore, the flagship Galaxy S series usually consists of three models, of which the Ultra notably comes with a Snapdragon 8 Gen 4 processor (expected). Whereas, the Standard and Plus use Snapdragon and Exynos chips depending on the region or country.
FOWLP is a next-generation packaging technology that does not use a printed circuit board (PCB) by installing semiconductors directly on the wafer. This widens the packaging area while reducing packaging thickness resulting in heat dissipation and improved heat dissipation performance.
As everyone knows, FOWLP was first implemented on the ‘Exynos 2400’, which was introduced in the Galaxy S24 series. It is noteworthy that Samsung was the first to use this technology in the processors of Galaxy series smartphones.
It is also noteworthy that FOWLP continues to be implemented on premium phones even after the Galaxy S24 series. However, at the moment there is no possibility that the Korean tech giant will implement FOWLP on Exynos for affordable phones like the Galaxy A series.
